Generalizing the soldering procedure

ar X iv : h ep - t h / 06 07 10 2 v 1 1 6 Ju l 2 00 6 Generalizing the Soldering procedure

We start this work by revisiting the problem of the soldering of two chiral Schwinger models of opposite chiralities. We verify that, in contrast with what one can conclude from the soldering literature, the usual sum of these models is, in fact, gauge invariant and corresponds to a composite model, where the component models are the vector and axial Schwinger models. As a consequence, we reint...

Ersa wave soldering systems

On Soldering Chiralities

We study how to solder two Siegel chiral bosons into one scalar field in a gravitational background. Permanent address: Instituto de F́ısica, Universidade Federal do Rio de Janeiro, Brasil [email protected] [email protected]

Brazing & Soldering Today

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...

Brazing & Soldering Today

Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...